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  1. NxGEN Electronics; It's in the name.

    NxGen Electronics, Advanced Packaging Technologies
    CSP1
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    NxGen1
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    Nxgen San Diego1

    www.dodgedemonclub.com - 2009-04-03

  2. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
    MCP2
    package design2
    CSP1
    BGA1
    memory modules1
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    advanced packaging1
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    DDR II1
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    integrated passives1
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    package solutions1
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    compliant chip1
    compliant layer1
    multi-chip1
    MBGA1
    microZ miniaturization1
    multi-chip package1
    package stacking1

    global.tessera.com - 2009-04-09

fine pitch bga1 bga1 die stacking1 pcb2 land grid array1 chip scale package1 csp1 for sale4 abr2 assembly2 integrated passives1 fbga1

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